Magnetic head device producing method with conductive pattern terminal portions extending outwardly from printed wiring board to contact head chip lead wires

ABSTRACT

A method of providing a magnetic head device comprises providing a head chip composed of a pair of head halves disposed in an opposed and abutting relation to each other. At least one thin film coil is formed on at least one of the opposed abutting surfaces of the pair of head halves and has lead wires electrically connected to the thin film coil. A head base to which a surface of the head chip is mounted is provided. A printed wiring board is bonded to the surface of the head base. The printed wiring board is provided with conductor wires extending thereover and each having a tip end which is brought into electrical contact with one of the lead wires connected to the thin film coil.

RELATED APPLICATION DATA

This application is a division of U.S. application Ser. No. 08/590,175filed Jan. 23, 1996, pending. The present and foregoing applicationclaim priority to Japanese application No. P07-010229 filed Jan. 25,1995. The foregoing application is incorporated herein by reference tothe extent permitted by law.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a magnetic head device for use in a video-taperecorder, a magnetic disc apparatus, or the like and a method ofproducing the magnetic head device, and more particularly to a magnetichead device provided with a coil formed by a thin film formation processand a method of producing such a magnetic head device.

2. Prior Art

A variety of magnetic heads have been employed for magneticrecording/reproducing apparatuses such as video-tape recorders (VTR),magnetic disc apparatuses or the like. Typical conventional magneticheads include, for example, so-called metal-in-gap type magnetic headscomposed of a magnetic core made of ferrite and a metal magnetic filmlayer formed on a magnetic-gap forming surface of the magnetic core,laminate-type magnetic heads composed of a pair of base members made ofa non-magnetic material and a metal magnetic film layer interposedbetween the pair of base members, or the like. In such a field, in orderto meet the requirements such as a high image quality, a digitalizedinformation data, etc., there is an increasing demand for magnetic headshaving a good electro-magnetic transformation characteristic in ahigh-frequency region.

However, the metal-in-gap type magnetic heads are not usable in thehigh-frequency region due to its large impedance.

On the other hand, in the laminate-type magnetic heads, in case that atrack width of recording medium should be decreased to meet arequirement of a high-densification thereof, it is necessary to reduce athickness of the metal film layer defining a magnetic path. This resultsin deterioration of a reproduction efficiency. Further, since themagnetic path is formed by the metal magnetic film layer solely, thereoccurs a problem in controlling a magnetic anisotropy thereof, whichmakes it difficult to obtain a high reproduction efficiency. That is, anideal condition for a magnetic anisotropy of magnetic head is generallythat an axis of easy magnetization of the metal magnetic film layer isalways oriented perpendicular to the direction of magnetic flux.However, it is actually difficult to maintain the perpendicularorientation of the axis of easy magnetization so that only amagnetically isotropic (non-orientation) metal film or uniaxial magneticanisotropy metal film have been used for the magnetic head.

In order to render the magnetic head usable in a high-frequency region,there has been proposed a magnetic head device provided with a magnetichead chip in which a magnetic path defined by a metal magnetic film isreduced as compared with those of normally used magnetic heads and athin film coil is formed on a magnetic gap-forming surface by using athin film formation technique, for example, as disclosed in Japanesepatent laid-open publications Nos. 231,713/88 and 248,305/91.

Conventionally used magnetic heads are shown in FIGS. 1 through 5. Themagnetic head shown in FIG. 1 is composed of a magnetic head chip 101provided thereon with a thin film coil, a head base 102 on one surfaceof which the magnetic head chip 101 is mounted, and a terminal plate 111generally mounted on the opposite surface of the head base 102. Formedon the terminal plate 111 are printed wiring boards 112 and 113 havingterminals 112a and 113a, respectively, which are electrically connectedwith terminals 117 of the thin film coil through sheathed wires 114 byusing a soldering or a conductive adhesive 115. The connecting portionsbetween respective terminals of the printed wiring boards 112 and 113and the magnetic head chip are covered with a molded resin 116.

Further, there has been a recent demand for a compactness of a rotatingdrum to which a magnetic head is mounted. In association with such ademand, primarily those for accomplishing a thin thickness of therotating drum, there has been proposed a magnetic head in which the headchip 101 and the terminal plate 111 are mounted on the same surface ofthe head base as shown in FIGS. 2 to 5. In the preparation of such amagnetic head as shown in FIG. 2, after mounting the head chip 101 on aprimary surface of the head base 102, the terminal plate 111 is fixedlybonded on the same primary surface of the head base 102, as shown inFIG. 3.

Successively, as shown in FIG. 4, one end of each of the sheathed wires114 is in contact with each terminal of the head chip 101 andelectrically connected therewith by using a soldering or a conductiveadhesive 115. The other end of each of the sheathed wires 114 is then incontact with each of the terminals 112a and 113a of the printed wiringboards 112 and 113 and electrically connected therewith by using asoldering or a conductive adhesive 115. Thereafter, the connectingportions between the head chip 101 and printed wiring boards 112 and 113is covered with the molded resin 116.

The thus constructed magnetic head is mounted on a rotating drum (notshown) in such a manner that the head base 102 with the head chip 101 isfitted, on a side of its surface where the terminal plate 111 is notmounted, to the rotating drum. The rotating drum is provided with arotary transformer which is electrically connected with the other endsof terminals 112 and 113 through sheathed wires by using a soldering ora conductive adhesive.

However, in the preparation of the conventional magnetic heads, it isdifficult to maintain the sheathed wires 114 between the terminals 112and 113 of the terminal plate 111 and the terminals 115 and 116 of thethin film coil provided on the head chip 101 until they are connectedwith each other. This results in not only complicated operationalprocedures but also an increase in risk of generating the damage to thesheathed wires by contact with hands when the magnetic head is invertedwhereby a yield or a reliability of the product are considerablydeteriorated. Furthermore, necessity of the wiring steps for thesheathed wires 114 or the like leads to increase in number of assemblingprocesses so that it becomes extremely difficult to achieve reduction ofthe production cost.

OBJECT AND SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide a magnetichead device having a high power and a low fraction defective.

It is another object of the present invention to provide a method ofproducing a magnetic head device, in which a facilitated connectionbetween a head chip and a head base can be achieved.

Accordingly, in accordance with one aspect of the present invention,there is provided a magnetic head device comprising a head chip composedof a pair of head halves disposed in an opposed abutting relation toeach other, at least one thin film coil formed on at least one ofopposed abutting surfaces of the pair of head halves and havingterminals connected to the thin film coil and disposed on one of thepair of head halves, a head base on one side surface of which the headchip is bonded, a printed wiring board bonded to the surface of the headbase, the printed wiring board being provided with conductor wiresextending thereover and each having a tip end which is brought into anelectrical contact with one of the terminals connected to said thin filmcoil.

Further, in accordance with another aspect of the present invention,there is provided a method of producing the above-mentioned magnetichead device, comprising the steps of fixing the head chip on the surfaceof the head base, and connecting tip ends of the conductive wires withterminals of the thin film coil simultaneously with fixing the printedwiring board on the surface of the head base.

The feature of the magnetic head device according to the presentinvention basically resides in that the head chip and the printed wiringboard are bonded to the same surface of the head base, and tip ends ofconductive wires extending over the printed wiring board is connectedwith terminals of the thin film coil which are provided on the headhalf.

Concretely, the tip end of each conductive wire provided on the printedwiring board is projected outwardly therefrom and disposed spaced upwardfrom a surface thereof so that the tip end comes into contact with theterminals of the thin film coil, which are located on the head half ofthe head chip, when the printed wiring board is mounted on the headbase.

In this case, it is preferred that a pair of thin film coils arerespectively provided on opposed abutting surfaces of the head halves ofthe head chip.

The above-mentioned head halves are suitably made of a non-magneticmaterial. However, the head halves may be also made of a magneticmaterial such as Mn--Zn ferrite. Further, it is preferred that the headhalves be composed of a base made of a non-magnetic material and a thinfilm made of a soft magnetic metal material and formed over the base.

Further, as mentioned above, further feature of the present inventionresides in the production method of the magnetic head device, includingthe steps of fixedly mounting the head chip on one side surface of thehead base, and fixing the printed wiring board on the same surface ofthe head base on which the head chip is mounted, and bringing the tipends of the conductive wires provided on the printed wiring board intocontact with terminals of the thin film coil simultaneously with thefixing of the printed wiring board on the head base.

Concretely, the tip ends of the conductive wires and the terminals ofthe thin film coil are electrically connected with each other by using asoldering or a conductive adhesive.

Thus, in the magnetic head device according to the present invention,the head chip composed of the head halves is fixedly bonded to one sidesurface of the head base and the terminals, which are electricallyconnected with the thin film coil, are provided on one of the headhalves. Further, the printed wiring board is fixed on the same surfaceof the head base on which the head chip is mounted such that the tipends of the conductive wires provided on the printed wiring board isbrought into contact with the terminals for the thin film coil formed onone of the head halves of the head chip. That is, in the production ofthe magnetic head device, when the printed wiring board is bonded to thesurface of the head base on which the head chip composed of the headhalves is mounted, the tip ends of the conductive wires extending overthe printed wiring board come into direct contact with the terminals ofthe thin film coil formed on one of the head halves of the head chip.The contact portions between the tip ends of the conductive wires andthe terminals of the thin film coil are bonded together to establish anelectrical connection therebetween. Thus, in the magnetic head deviceaccording to the present invention, the connection between the terminalsof the respective elements can be performed easily and surely withoutusing particular sheathed wires upon mounting the head chip on the headbase.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view schematically showing one example ofconventional magnetic head devices.

FIG. 2 is a perspective view schematically showing another example ofconventional magnetic head devices.

FIG. 3 is a perspective view schematically showing the conventionalmagnetic head device of FIG. 2, in which a head chip and a printedwiring board are mounted on the same primary surface of a head base.

FIG. 4 is a perspective view schematically showing the conventionalmagnetic head device in which sheathed wires are electrically connectedto terminals of the head chip mounted on the primary surface of the headbase.

FIG. 5 is a perspective view schematically showing the conventionalmagnetic head device in which the sheathed wires are electricallyconnected at the other ends thereof to terminal ends of the conductorwires and the connected portions are covered with a molded resin.

FIG. 6 is a perspective view schematically showing one embodiment of amagnetic head device according to the present invention.

FIG. 7 is a perspective view schematically showing a head chip of themagnetic head device according to the present invention.

FIG. 8 is an enlarged view schematically showing a portion of abuttingsurfaces of a pair of head halves constituting the head chip of themagnetic head device according to the present invention.

FIG. 9 is a sectional view taken along the broken line A-A' of FIG. 8.

FIG. 10 is a perspective view schematically showing a printed wiringboard of the magnetic head device according to the present invention.

FIG. 11 is a perspective view schematically showing a head chip base ona primary surface of which a plurality of grooves are formed with aninclined angle of about 40 degrees relative to the primary surface.

FIG. 12 is a perspective view schematically showing the head chip baseprovided on the primary surface thereof with a magnetic layer.

FIG. 13 is a perspective view schematically showing the head chip basein which there are provided additional grooves extending perpendicularto the grooves previously mentioned in FIG. 11 to remove unnecessaryportions of the magnetic layer whereby spaces for forming thin filmcoils and magnetic paths are produced.

FIG. 14 is a perspective view schematically showing the head chip basewhich has a fused glass filled in the grooves.

FIG. 15 is a perspective view schematically showing the head chip baseon which grooves for restricting a tracking width of the magnetic headdevice are formed.

FIG. 16 is a perspective view schematically showing the head chip basein which the grooves for restricting the tracking width are filled witha fused glass.

FIG. 17 is an enlarged schematic plan view of the head chip base inwhich a recess for forming a thin film coil is provided on a surface ofthe fused glass.

FIG. 18 is a sectional view taken along the broken line B-B' of FIG. 17.

FIG. 19 is an enlarged schematic plan view showing the condition inwhich first or second thin film half is formed in the recess.

FIG. 20 is a sectional view taken along the broken line C-C' of FIG. 19.

FIG. 21 is an enlarged schematic plan view showing the condition inwhich the first or second thin film half is covered with a protectivecoat.

FIG. 22 is a sectional view taken along the broken line D-D' of FIG. 21.

FIG. 23 is a perspective view schematically showing a pair of segmentblocks 4 and 34 of the head chip base which are then brought into anabutting contact with each other and bonded together.

FIG. 24 is a perspective view schematically showing a head base on onesurface of which the head chip is mounted.

FIG. 25 is a perspective view schematically showing the head basetogether with a printed wiring board to be mounted on the surface of thehead base on which the head chip is already mounted.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

A magnetic head device and a method of producing the magnetic headdevice according to the present invention are described in more detailby way of the preferred embodiment by referring to the accompanyingdrawings.

Referring now to FIG. 6, there is shown a magnetic head device accordingto the present invention, which comprises a head chip 1, a head base 2to which the head chip 1 is mounted, and a printed wiring board 3 bondedto the head base 2 to electrically connect the head chip 1 with arotating drum (not shown).

As shown in FIG. 7, the head chip 1 is composed of a pair of head halves11 and 41 both made of a non-magnetic material. The head halves 11 and41 are bonded together through a magnetic gap g in an abutting fashion.Further, as shown in FIGS. 8 and 9 in which FIG. 9 shows a section takenalong the line A-A' of FIG. 8, the head halves 11 and 41 are provided onabutting surfaces thereof with first and second thin film halves 8 and38, respectively. The first and second thin film halves 8 and 38 havethereon first and second thin film coils 17 and 47, respectively, whichare made of a conductive material. The first and second thin film coils17 and 47 are formed by using a thin film formation technique such as aphoto-lithography or the like. Thus, there is formed a closed magneticpath in which the magnetic gap g having a given azimuth angle islocated.

Specifically, the above-mentioned first thin film half 8 is provided ina recess 13 which is formed on a surface of a fused glass 16 depositedon the magnetic layer 7, by using an ion-etching method or the like. Thefirst thin film half 8 includes the first thin film coil 17 made of aconductive metal material and disposed between segments of a magneticlayer 7, a pair of lead-wire electrodes 5 and 6, and a coil terminalportion 20 disposed in the recess 13. The first thin film coil 17 iselectrically connected at opposite ends thereof with the coil terminalportion 20 and the lead-wire electrode 5. The first thin film half 8 iscovered with a protective coat 21 made of an insulating material exceptfor terminal portions 5a and 6a of the lead-wire electrodes 5 and 6.Metal film portions 24, 25, 26 and 27 are formed on the terminal portion20, portions of lead-wire electrodes 5 and 6, which are exposed to thesurface of the protective coat 21 by a flattening thereof, and a regionsurrounding the recess 13, respectively. As, illustrated, terminalportion 20 is positioned on a contact portion 14a, formed in the from ofa protrusion in recess 13, so as to be positioned above the remainder ofthin film coil 17.

On the other hand, the second thin film half 38 is provided in a recess43, which is formed on a surface of a fused glass 16 deposited on amagnetic layer 37, by using an ion-etching method or the like, in asimilar manner to the first thin film half 8. The second thin film half38 includes a second thin film coil 47 made of a conductive metalmaterial and disposed between segments of the magnetic layer 37, acontact terminal 52 connected to the second thin film coil 47, and acoil terminal portion 50 disposed in the recess 43. The second thin filmcoil 47 is electrically connected at opposite ends with the coilterminal portion 50 and the contact terminal 52, respectively. Thesecond thin film half 38 is covered with a protective coat 51 made of aninsulating material. Metal film portions 54, 56 and 57 are formed on thecoil terminal portion 50, a portion of the contact terminal 52, which isexposed to the surface of the protective coat 51 by a flatteningthereof, and a region surrounding the recess 43, respectively. Asillustrated, terminal portion 50 is positioned on a portion 44a, formedin the form of a protrusion, so as to be positioned above the remainderof thin film coil 47.

The thus constructed head halves 11 and 41 having the first and secondthin film halves 8 and 38, respectively, come into an abutting contactwith each other in the direction as shown by an arrow M in FIG. 8 andbonded together to form the head chip 1. At this time, electricalconnections are established between coil terminal portions 20 and 50(namely, between the metal film portions 24 and 54), between thesegments of the magnetic layers 7 and 37 exposed to the surface of theprotective coat 21 and 51, between the metal film portions 26 and 56(namely between the lead-wire electrode 6 and the contact 56), andbetween the metal film portions 27 and 57 (namely between the segmentsof the magnetic layers 7 and 37).

As shown in FIG. 10, the printed wiring board 3 is composed of a baseplate 61 and conductor wires 66 and 67 disposed on the base plate 61.The conductor wires 66 and 67 are provided at one end thereof withterminal portions 62 and 63 which are brought into a direct contact withthe terminal ends 5a and 6a of the lead-wire electrodes 5 and 6 whichare in turn connected with the thin film coils 17 and 47, respectively.Meanwhile, the conductor wires 66 and 67 are connected at the other ends64 and 65 thereof with terminals of the rotating drum (not shown). Thenumber of the terminal portions derived from the conductor wires isdetermined correspondingly depending upon that of the terminals derivedfrom the thin film coils.

The terminal portions 62 and 63, which extend outwardly from the printedwiring board 3, are projected upward so as to be spaced from a surfacethereof. Further, the terminal portions 62 and 63 have a bent shape suchthat the tip ends thereof can be brought into contact with the terminalend portions 5a and 6a of the lead-wire electrodes 5 and 6 when theprinted wiring board 3 is mounted on the head base 2. The contactportions between the terminal portions 62 and 63 of the conductor sires66 and 67 and the terminal end portions 5a and 6a of the lead-wireelectrodes 5 and 6 are electrically connected with each other by using asoldering or a conductive adhesive 68 and then covered with a moldedresin 69.

In the preparation of the magnetic head device, as shown in FIG. 11, aplate-like head chip base 15 made of a non-magnetic material is firstslotted to provide a plurality of grooves on a primary surface thereof.Each groove has an inclined surface with an angle of about 40 degreesrelative to the primary surface of the head chip base 15. The angle ofthe inclined surface of the groove constitutes the azimuth angle of themagnetic gap g. As shown in FIG. 12, a magnetic layer 7 made of amagnetic material such as sendust is then deposited on the primarysurface of the head chip base 15. In this case, in order to improve itsadherence to the primary surface of the head chip base 15 and itsmagnetic property, the magnetic layer 7 may be provided through anunderlying layer made of oxide or metal such as aluminum on the primarysurface of the head chip base 15. Further, a protective coat may beprovided on the magnetic layer 7 to prevent an undesired reactionbetween the magnetic layer 7 and a fused glass 16 filled in the groove 9described in detail hereinafter.

Next, as shown in FIG. 13, grooves 10 and 11 extending perpendicular tothe grooves 9 are formed on the primary surface of the head chip base15. The grooves 10 serve for assuring a space for forming the thin filmcoil while the grooves 11 serve for removing unnecessary portion of themagnetic layer 7 from the head chip base 15. Successively, the fusedglass 16 is filled in the respective grooves as shown in FIG. 14 andunnecessary portion of the fused glass is removed, if desired.

As shown in FIG. 15, grooves 12 extending parallel with the grooves 9are slotted to remove the magnetic layer 7 except for that disposed onthe inclined surface of each groove 9. The grooves 12 serves forrestricting a tracking width. After the grooves 12 are filled with thefused glass, the head chip base 15 is subjected to a grinding to flattenthe primary surface of the head chip base 15, as shown in FIG. 16.

Thereafter, as shown in FIG. 17, by using an ion-etching method or thelike, a recess 13 is provided on the surface of the fused glass (on theprimary surface of the head chip base 15). The recess 13 serves forforming the thin film coil therein. Formed in the recess 13 are contactportions 14a, 14b and 14c in the form of a protrusion as shown in FIG.18 which is a sectional view taken along the broken line B-B' of FIG.17. The contact portion 14a serves for providing thereon an terminal endportion of the thin film coil while the contact portions 14b and 14cserve for providing thereon connecting terminals for the lead-wireelectrodes.

Then, as shown in FIGS. 19 and FIG. 20, (FIG. 20 shows a sectional viewtaken along the broken line C-C' of FIG. 19), the first and second thinfilm halves 8 and 38 each having a predetermined pattern are formed inthe recess 13 by using a photo-mask having a corresponding pattern.Meanwhile, in FIGS. 19 and 20, only the first thin film half 8 isillustrated. In FIG. 20, the photo-mask for forming the patterns of thethin film coil 17 and the terminal end portion 20 of the thin film coil17 is illustrated by a phantom line.

Next, as shown in FIG. 21 and FIG. 22 (FIG. 22 is a sectional view takenalong the line D-D' of FIG. 21), a surface of the first thin film half 8except for tip ends 5a and 6a of the lead-wire electrodes 5 and 6 iscovered with a protective coat 21 made of an insulating material byusing a sputtering method. The protective coat 21 is then subjected to agrinding to flatten a surface thereof so that given portions of thelead-wire electrodes 5 and 6 are exposed to the surface of theprotective coat 21. Then, metal films 24, 25, 26 and 27 are formed onthe terminal end portion 20, the given exposed portions of the lead-wireelectrodes 5 and 6 and a region of the primary surface of the base plate15 surrounding the recess 13, respectively.

On the other hand, the second thin film half 38 is covered with aprotective coat 51 made of an insulating material. The protective coat51 is then subjected to a grinding to flatten a surface thereof so thata given portion of a contact terminal 52 is exposed to the surface ofthe protective coat 51. Deposited on the coil terminal portion 50 of thethin film coil 47, the exposed given portion of the contact terminal 52and a region of the primary surface of the base plate 15 surrounding therecess 43 are metal films 54, 56 and 57, respectively.

The thus constructed blocks for the head halves 11 And 41 are cut intosegment blocks 4 and 34 having an appropriate dimension in which aplurality of the thin film halves 8 and 38 are formed, as shown in FIG.23. Both the segment blocks 4 and 34 abuts against each other in thedirection indicated by an arrow M in the figure and are integrallybonded to each other such that the given portions of the first andsecond thin film halves 8 and 38, on which conductive metal films areprovided, are brought into contact with each other to establish anelectrical connection therebetween.

Thereafter, the thus integrated segment blocks 4 and 34 are cut intoindividual pieces composed of a pair of head halves 11 and 41 whichcarry the first and second thin film halves 8 and 38, respectively. Therespective pieces are then subjected to subsequent processes to finishindividual head chips 1.

The head chip 1 thus obtained is then mounted on a primary surface ofthe head base 2, as shown in FIG. 24. Successively, the printed wiringboard 3 is bonded to the primary surface of the head base 2, as shown inFIG. 25. The printed wiring board 3 is provided with conductor wires 66and 67 made of a conductive metal material. The conductor wires 66 and67 are subjected to an appropriate machining such as a press-working sothat front end portions of the conductor wires 66 and 67 are bent intogiven shapes to form terminal ends 62 and 63, respectively.

When the thus formed printed wiring board 3 is bonded onto the head base2, the terminal ends 62 and 63 of the conductor wires 66 and 67 aredisposed in a floating manner on the printed wiring board 3 andconnected with the tip ends 5a and 6a of the lead-wire electrodes 5 and6 which serve as the external terminal ends of the thin film coil 17.The terminal ends 62 and 63 is then electrically connected with the tipends 5a and 6a by using a soldering or a conductive adhesive 68. Theconnecting portions between the terminal ends 62 and 63 and the tip ends5a and 6a of the conductor wires 5 and 6 are covered with a resinmaterial 69 by a resin-molding method.

As mentioned above, the magnetic head device according to the presentinvention includes the head chip 1 composed of a pair of head halves 11and 41 disposed in an opposed abutting relation to each other. The headhalves 11 and 41 are provided, at opposed abutting surfaces thereof,with thin film coils 17 and 47 which are electrically connected with thelead-wire electrodes 5 and 6 having the tip ends 5a and 6a,respectively, which are provided on the head half 11. The head chip 1 ismounted on one side surface of the head base 2 and bonded thereto.Further, the printed wiring board 3 is adhered onto the same surface ofthe head base 2. The printed wiring board 3 is provided thereon withconductor wires 66 and 67 which are formed corresponding to the numberof the terminals derived from the thin film coils 62 and 63 (in thisembodiment, two conductor wires are provided). When the printed wiringboard 3 is mounted on the head base 2, the terminal ends 62 and 63 ofthe conductor wires 66 and 67 are directly connected to the tip ends 5aand 6a of the lead-wire electrodes 5 and 6. That is, in the preparationof the magnetic head device, when the printed wiring board 3 is mountedon and bonded to one side surface of the head base 2 on which the headchip 1 is also bonded, the terminal ends 62 and 63 of the conductorwires 66 and 67 on the printed wiring board 3 is directly contacted withand therefore electrically connected with the tip ends 5a and 6a of thelead-wire electrodes 5 and 6 exposed on a surface of the head chip 1. Asa result, upon mounting the printed wiring board 3 to the head base 2,an electrical connection between the head chip 1 and the printed wiringboard 3 can be easily and surely accomplished without using a sheathedwire or the like.

Accordingly, not only a reliability of the product is enhanced to agreat extent, but also the production cost and the production time canbe considerably reduced because a bonding process between the respectiveterminals by using sheathed wires can be omitted.

As mentioned above, in accordance with the present invention, it becomespossible to manufacture a magnetic head device having a high power witha low fraction defective. Further, there can be provided a method ofproducing such a magnetic head in which a head chip is easily mounted ona head base.

What is claimed is:
 1. A method for securing a magnetic head to a headchip comprising the steps of:a) providing a head chip composed of a pairof head halves disposed in an opposed and abutting relation to eachother, and having lead wires of a thin film coil disposed on one of saidpair of head halves; b) providing a head base having a side surface onwhich said head chip is mounted; c) bonding a printed wiring board tosaid side surface of the head base, said printed wiring board having awire pattern formed thereon comprising two conductor wires, each ofwhich has a unitary terminal portion formed in situ with the formationof the wire pattern and which is an extension of one of the conductorwires and which has a tip end which is brought into electrical contactwith a respective one of said lead wires of said thin film coil, theunitary terminal portions extending outwardly from the printed wiringboard and projecting upwardly therefrom and away from said side surfaceof said head base and being sufficiently rigid so as to be spaced fromsaid side surface of said head base in a self-supporting manner, andeach of the terminal portions having a bend such that the tip endsthereof will contact the lead wires of said thin film coil in aself-registering manner as the printed wiring board is mounted on thehead base; and d) securing said head chip on the side surface of saidhead base while bringing said tip ends of said conductor wires intocontact with said lead wires of said thin film coil.
 2. The methodaccording to claim 1, wherein said tip ends of said conductor wires areelectrically connected with said lead wires of said thin film coil byusing a soldering or a conductive adhesive.